EMI rejection for near field links

ABSTRACT

For near field communications, inductive coils coupled to each communicating circuit are brought close together so that there is inductive coupling between the two coils. Data signals can then be relayed between the two circuits without any direct connection between them. However, the system is susceptible to common mode noise, such as ambient EMI. In addition to the “active” coil pairs used for transmitting and receiving data, a pair of “passive” coils is provided, proximate to the active coil pairs, that is only used for detecting the ambient EMI. The EMI signals detected by the passive coils are processed by a noise detector/processor, and the noise detector processor then controls the transmitters and/or receivers to at least partially compensate for the detected EMI signals. Transmit power or receiver thresholds may be controlled by the noise detector/processor to improve the signal-to-noise ratio, or other compensation techniques can be used.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of PCT Application Serial No.PCT/US2019/021,898 filed Mar. 12, 2019, by Kenneth G. Richardson, whichclaims priority to U.S. application Ser. No. 16/298,913, filed. Mar. 11,2019, by Kenneth G. Richardson, which is based on and claims priorityfrom U.S. Provisional Patent Application Ser. No. 62/647,464, filed Mar.23, 2018, by Kenneth G. Richardson, which are incorporated herein byreference in their entirety.

FIELD OF THE INVENTION

This invention relates to circuits that communicate with each otherusing near field RF, which provides galvanic isolation between circuits,and, in particular, to reducing the effects of common mode noise on thequality of the communications.

BACKGROUND

In some situations it is desirable to electrically isolate two circuitsfrom each other while enabling the circuits to communicate. This may bedone for isolating the circuits' grounds from each other, or forreducing the coupling of noise from one circuit to the other, or for anyother purpose. Common techniques used for such “galvanic isolation”include using transformers or optical links.

Transformers tend to be relatively large and expensive. Optical linksrequire an LED and a photodetector, which add significant size and costto the circuits. Optical links are not susceptible to electromagneticinterference (EMI), but the electronics in the photodiode detectorcircuit are susceptible to EMI. Shielding of connectors may be used tomitigate the effects of ambient EMI, and internal EMI shielding may beadded to the package, but such shielding adds cost. Filters to filterout the EMI may be added to the receiver but add signal delay.

What is needed is a more compact and inexpensive technique togalvanically isolate two or more circuits, such as separate dies withinan integrated circuit (IC) package, or separate circuits on a printedcircuit board (PCB), that communicate with each other, where thecommunications link is robust in the presence of EMI.

SUMMARY

The present invention involves improvements in near field RFcommunication techniques between circuits mounted on the same PCB.

For near field communications, inductive coils coupled to each circuitare brought close together so that there is inductive coupling betweenthe two coils. Data signals can then be relayed between the two circuitswithout any direct connection between them. However, due to the natureof the inductive coupling, the system is susceptible to common modenoise. Such noise may be generated by high frequency switching circuitsor by any other source of noise, causing EMI. Such noise, if strongenough, could result in signal corruption and/or data errors.

Techniques are described herein to reduce the susceptibility of the datato errors caused by EMI when using near field communications betweencircuits.

One technique is to provide the inductive coils very close to oneanother to improve the magnetic coupling. The induced voltage isproportional to the inverse cube of the transmission distance. This isdone by patterning flat spiral coils of a conductive material (e.g., ametal) to form overlapping inductive antennas that are separated by athin dielectric, such as polyimide. Therefore, there is very goodmagnetic coupling and good signal-to-noise ratio. The overlappingarrangement of the flat coils results in a small size.

A second technique is to provide an additional near field antenna,identical to the antennas used for the communicating circuits, that isonly used to detect the level of EMI. This added “passive” EMI detectioncircuit is proximate to the “active” circuits that are communicatingwith each other on the same PCB so that the detected EMI would be thesame as that experienced by all the communicating circuits. Once thelevel of EMI is detected by the EMI detection circuit, the EMI detectioncircuit may control the receivers of the communicating circuits to setan optimal threshold for determining whether a transmitted digitalsignal is a one or a zero.

The EMI detection circuit may also control the output power of thetransmitters to increase in the presence of a relatively high EMIsignal.

The detected EMI signal waveform may also be subtracted from thereceived data signal waveform to offset any EMI signal in the data path.Similarly, there may be pre-emphasis by subtracting the detected EMIsignal from the transmitted data signal.

Accordingly, inexpensive and compact near field RF isolation may be usedto isolate communicating circuits with very good noise rejection byusing any combination of the above-described techniques. The techniquesare applicable to circuits that use differential signals as well assingle ended signals.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic illustration of an IC package containing two dieshaving “active” circuits that communicate with each other using nearfield RF communication. Also included in the package is an EMI detectioncircuit that “passively” detects the EMI experienced by the activecircuits and improves the signal-to-noise ratios of the active circuitsbased on the detected EMI.

FIG. 2 illustrates a portion of a receiver and how the detected commonmode EMI signals can be used to offset the EMI component of the datasignals, and also used to control the threshold of the receiver.

FIG. 3 illustrates a receiver portion similar to that of FIG. 2 but thesignals at both ends of the EMI sense coil and the active receiver coilare subtracted to maintain phase coherence.

FIG. 4 illustrates a portion of a transmitter and how the detectedcommon mode EMI signals can be used to offset the EMI component of thedata signals, and also used to control the output power of thetransmitter.

FIG. 5 illustrates a differential data system for one of the activecircuits, where the EMI detection circuit uses the same near fieldantenna structure to detect the EMI experienced by the active circuitsand improve the signal-to-noise ratios of the active circuits based onthe detected EMI.

FIG. 6 illustrates a flat spiral coil used as a near field inductiveantenna in the embodiments.

FIG. 7 is a cross-sectional view of the near field antenna system usedfor all circuits, where a pair of identical coils overlap and areseparated by a thin dielectric.

FIG. 8 is a flowchart summarizing the techniques used for improving thesignal-to-noise ratio of the data signals based on the detected EMI.

Elements labeled with the same numeral in the various embodiments may bethe same or equivalent.

DETAILED DESCRIPTION

FIG. 1 illustrates an IC package 10 containing two dies 12 and 14. Thepackage 10 has terminals for connection to a printed circuit board. Thetwo dies 12 and 14 include any circuitry that needs to communicatebetween the dies 12 and 14. Digital data is presumed in the embodiments,although analog information may also be communicated.

Only the transmitters and receivers are shown in the dies 12 and 14, forfour communication channels, since the other circuitry in the dies thatgenerate the baseband data may be any conventional circuitry for anyapplication. Active transmitters 16 and 16A and active receivers 18 and18A are in the die 12, and active transmitters 20 and 20A and activereceivers 22 and 22A are in the die 14. There may be more or lesscommunication channels. The transmitters and receivers may also betransceivers where the transmit and receive functions use the sameantenna. The transmitters may receive baseband data and modulate an RFcarrier, such as at about 500 MHz. The modulated signal may beamplified.

Although FIG. 1 shows the dies 12 and 14 within a single package, thedies 12 and 14 may be in separate packages mounted on a printed circuitboard.

Also shown is a passive circuit that just receives EMI signals,comprising receivers 24 and 24A.

The four channels communicate by near field RF communications, allowingthere to be no direct electronic connection between the two paddles(flat area of the metal lead frame where the die is attached) in thepackage 10. This enables the grounds associated with the paddles of thedies 12 and 14 to be independent and helps prevent noise generated inone side of a package (such as switching noise) from being coupled to acircuit in the other side of the package. There may be additional ICs inthe package 10 that communicate with each other. Other reasons forgalvanically isolating circuits exist.

Each transmitter is connected to a substantially identical inductivecoil 26, 26A, 28B, and 28C, and each receiver is connected to asubstantially identical inductive coil 28, 28A, 26B, and 26C. Thereceive and transmit coil pairs are very close to one another and arefabricated on the same substrate for good magnetic coupling. Such coilsare described in detail later with respect to FIGS. 6 and 7. In oneembodiment, the two coils in a coil pair are flat metal spirals thatoverlap and are separated by a thin dielectric.

All the coils are within the package 10 and are connected to the dies 12and 14 by bond wires or metal traces. If the dies 12 and 14 are inseparate packages, the coils may be external modules mounted on aprinted circuit board.

Each die 12 and 14 has output pads coupled to the ends of the respectivecoils for either providing a current through a coil for transmitting amodulated data signal, or for receiving a voltage induced in theassociated coil in the pair for receiving the modulated data signal. Inone embodiment, the carrier is at 13.56 MHz. The carrier frequency maybe much higher, and any type of modulation may be used (e.g., AM, FM,etc.).

One problem with near field communications is that it is sensitive toEMI. Ambient EMI may be received by any of the coils, and the EMIwaveform combines with the data waveforms. If the EMI is strong enough,the data signals will be corrupted, producing errors. Although shieldingthe packages and coils may reduce the EMI received by the coils, suchshielding is expensive and adds bulk.

The system of FIG. 1 includes a passive circuit that only receives EMIsignals using coils 30 and 32 that are substantially identical to thetransmit and receive coils of the active circuits, such as the coils 26and 28. Therefore, since the passive coils 30 and 32 are proximate toall the other circuitry in the same package and are the same design, theEMI signals received by the passive coils 30 and 32 should be about thesame as the EMI signals received by all the active coils.

All coils should be terminated in the same way for matching impedancesfor maximizing efficiency, such as by a conventional capacitor/resistornetwork connected to the package's ground.

As the system is operating to generate and communicate modulated databetween the dies 12 and 14, the passive EMI detection circuit,comprising the passive coils 30 and 32 and the receivers 24 and 24A,receives the same EMI signals received by all the other coils. Thereceived EMI signals are processed by an associated common mode (CM)noise detector/processor 34 and 34A. The detector/processor 34 and 34Amay determine the RMS power of the EMI signals, or measure the peakamplitude of the EMI signals, or determine other characteristics of thereceived EMI signals. The particular detection and processing of EMIsignals depend on how the designer wants to compensate the receiversand/or transmitters for the detected EMI. Such a circuit design is wellwithin the skills of one skilled in the art. The detector/processor 34and 34A then applies the EMI waveform and/or the detected EMIcharacteristics to the various active transmitters and active receiversto mitigate the effects of the EMI signal on the data communications.

In one example shown in FIG. 1, the detector/processor 34 and 34Agenerates an output power control signal on lines 38 and 38A tooptimally control the output power of the active transmitters 16, 16A,20, and 20A. This may just control the power amplifier that outputs themodulated data signals. The magnitude of the input signal into the poweramplifier may also be controlled. When the detected EMI signal isrelatively high, the power control signal increases the output power ofthe transmitters to improve the signal-to-noise ratio.

An additional technique is to raise or lower the thresholds of theactive receivers, where the threshold determines whether a receiveddemodulated signal is a logical one or a zero. In the presence of strongcommon mode noise, the thresholds would be raised to prevent thereceiver from indicating that a noise spike is data. This control of thethreshold is shown by the detector/processor 34 and 34A outputting athreshold control signal on the lines 40 and 40A.

FIG. 2 illustrates another technique where the detected EMI waveform onthe coil 30 or 32 is used to offset the EMI component of a receivedsignal on one of the active receiver coils 26B, 26C, 28, and 28A. Thismaintains phase coherency between the EMI waveform and the data signals.FIG. 2 illustrates a portion of any of the active receivers. The EMIsignal across the EMI sense coil 30 or 32 is applied to an amplifier orbuffer 40, and the combined data and EMI signal from the active receivercoil (e.g., coil 28) is applied to an identical amplifier or buffer 41.The amplified signals are applied to inputs of a summer 42 forsubtracting the EMI waveform from the combined data/EMI waveform tocancel out the EMI component of the data/EMI waveform. The output of thesummer 42 then is approximately only the data signal without noise. Toreduce the effects of EMI even further, the CM noise detector/processor34 or 34A can adjust the voltage threshold 44 of the receiver. Theadjusted threshold is applied to one input of a comparator 46 forcomparison to the data signal (assuming amplitude modulation is used) todetermine whether the signal is a logical one or zero. A higher strengthEMI signal would cause the threshold to be raised to avoid falsetriggering of the comparator 46. The digital output of the comparator 46is thus compensated for the common mode EMI.

Although the circuit of FIG. 2 is for single-ended data, the circuit canbe easily modified for differential data by applying the compensation tothe positive and negative data channels.

FIG. 3 illustrates a receiver portion similar to FIG. 2 but the signalsat both ends of the EMI sense coil and the active receiver coil aresubtracted to maintain phase coherence. The four input signals into thesummer 47 may be amplified or buffered as needed. Buffering may be usedto reduce loading on the coils. The output of the summer 47 isdifferential and applied to an amplifier 48. The output of the amplifier48 is applied to the input of the comparator 46, as discussed withrespect to FIG. 2.

FIG. 4 illustrates a portion of each transmitter 16, 16A, 20, and 20A,where the sensed EMI signal is applied to the input of an amplifier orbuffer 50. The output of the amplifier or buffer 50 is applied to oneinput of a summer 52. A signal proportional to the modulated transmitsignal applied to the transmit coil (e.g., coil 26 in FIG. 1) isgenerated by an amplitude detector 54 and applied to the other input ofthe summer 52. Amplitude detector 54 and amplifier or buffer 50 applysignals to the summer 52 that are proportional to the respective powersof the two signals. The magnitude of the output of the summer 52therefore reflects the relative power levels of the EMI signal andtransmitter output signal. If the EMI signal is relatively high, theoutput of the summer 52 controls the modulator or power amplifier 56 toincrease the output power of the transmitter to improve thesignal-to-noise ratio of the transmitted signal.

In another embodiment, the detected EMI waveform may be subtracted fromthe baseband data signal for pre-emphasis of the transmitted signal tooffset the EMI component coupled to the transmit coil 26.

Improvements of 10-20 dB in signal-to-noise ratio can be achieved usingthe techniques described herein. The performance improvement somewhatdepends on the wavelengths of the EMI signal, where shorter wavelengthsmay affect the receivers and transmitters in differing amounts if thedistance from the signal coil (e.g., coil 28 in FIG. 1) that is furthestfrom the EMI detection coil 30/32 is greater than about lambda/20 fromthe EMI detection coil 30/32, where lambda is the wavelength of theshortest significant component of EMI signal in the environment of thesystem.

FIG. 5 illustrates a differential transmitter 60 and receiver 62 usingtwo pairs of coils 64 and 66 for near field communication of thedifferential data signals. The same EMI compensation techniquesdiscussed above may be applied to the differential system.

FIG. 6 is a top down view of one of the coils 68 (e.g., a transmittercoil). All coils should be substantially identical to the EMI detectioncoils 30/32. In one embodiment, a thin layer of copper is laminated on athin (e.g., 20 micron) polyimide sheet 69 (FIG. 7) and etched to form aflat spiral coil with the appropriate number of turns.

As shown in FIG. 7, a substantially identical coil 70 (a receiver coil)is laminated to the transmitter coil 68 or simply formed on the oppositeside of the polyimide sheet. The width of the coils may be less than onemillimeter. As such, the two coils are very close together for excellentmagnetic coupling for high signal-to-noise ratio, and the structure isvery flat, reproducible, and inexpensive. The coil pair of FIG. 7 may bea separate die with leads for connection to the dies 12 and 14 withinthe package 10, or the coil pair of FIG. 7 may be formed directly on oneor both of the dies 12 and 14.

The transmit and receive coils may have different “turns”. The EMIdetection coils 30/32 should have the same top and bottom coils as thetransmit and receive coils to detect the same EMI as the transmit andreceive coils.

Various other circuit designs may be used to implement the invention.

FIG. 8 is a flowchart summarizing the descriptions above. In step 80,the active circuits are provided in one or more IC packages andcommunicate with each other using near field RF.

In step 82, the active coils are provided that overlap for good magneticcoupling and good signal-to-noise ratio.

In step 84, passive coils (preferably substantially identical to theactive coils) are provided that receive the same EMI signals received bythe active coils.

In step 86, the EMI signals detected by the passive coils are processedto determine the strength of the EMI signals.

In step 88, based on the detected EMI signals from the passive circuit,the receive and transmitted signals may be compensated for EMI by anycombination of techniques.

These techniques include: 1) varying the thresholds of the receivers; 2)varying the output power of the transmitters; and 3) subtracting the EMIwaveform from the received data or the data to be transmitted.

While particular embodiments of the present invention have been shownand described, it will be obvious to those skilled in the art thatchanges and modifications may be made without departing from thisinvention in its broader aspects and, therefore, the appended claims areto encompass within their scope all such changes and modifications thatare within the true spirit and scope of this invention.

What is claimed is:
 1. A near field (NF) communication link comprising:a first inductive coil coupled to a transmit side of the NFcommunication link; a second inductive coil coupled to a receive side ofthe NF communication link; a first electromagnetic interference (EMI)detection circuit; and a third inductive coil in electricalcommunication with the first EMI detection circuit; wherein the firstEMI detection circuit detects an EMI signal received by the thirdinductive coil and at least one of the first inductive coil or thesecond inductive coil, and adjusts at least one of transmitting of adata signal by the transmit side or receiving of the data signal by thereceive side based on the detected EMI signal.
 2. The NF communicationlink of claim 1, wherein the transmit side of the NF communication linkincludes a transmitter circuit, the receive side of the NF communicationlink includes a receive circuit, and the first EMI detection circuit isconfigured to change an output power of the transmit circuit based onthe detected EMI signal.
 3. The NF communication link of claim 1,wherein the transmit side of the NF communication link includes atransmit circuit, the receive side of the NF communication link includesa receive circuit, and the first EMI detection circuit is configured tochange a threshold of the receive circuit that determines a logic levelof a received data signal.
 4. The NF communication link of claim 1,including: a transmit circuit coupled to the first inductive coil; areceive circuit coupled to the second inductive coil; and a summercircuit in electrical communication with the second inductive coil andthe third inductive coil; wherein the summer circuit compensates areceive signal received by the second inductive coil using the EMIsignal received by the third inductive coil.
 5. The NF communicationlink of claim 4, wherein the summer circuit subtracts the EMI signalfrom the receive signal.
 6. The NF communication link of claim 1,including: a transmit circuit coupled to the first inductive coil; afirst receive circuit coupled to the second inductive coil; and a secondreceive circuit coupled to the third inductive coil and the EMIdetection circuit; wherein the third inductive coil is identical to thesecond inductive coil and positioned proximate the second inductivecoil.
 7. The NF communication link of claim 1, including: a second EMIdetection circuit; and a fourth inductive coil in electricalcommunication with the second EMI detection circuit; wherein the secondEMI detection circuit is configured to improve a signal-to-noise ratioof a data signal based on EMI signals detected by the fourth inductivecoil.
 8. The NF communication link of claim 7, including: a transmitcircuit on the transmit side of the NF communication link, wherein thetransmit circuit and the second EMI detection circuit are included in afirst integrated circuit die of an integrated circuit package; and areceive circuit on the receive side of the NF communication link,wherein the receive circuit and the first EMI detection circuit areincluded in a second integrated circuit die of the integrated circuitpackage.
 9. The NF communication link of claim 7, including: a transmitcircuit on the transmit side of the NF communication link, wherein thetransmit circuit and the second EMI detection circuit are included in afirst integrated circuit die of a printed circuit board; and a receivecircuit on the receive side of the NF communication link, wherein thereceive circuit and the first EMI detection circuit are included in asecond integrated circuit die of the printed circuit board.
 10. The NFcommunication link of claim 1, including: a fourth inductive coilcoupled to the transmit circuit for transmitting a differential datasignal in conjunction with the first inductive coil; and a fifthinductive coil coupled to the receive circuit for receiving thedifferential data signal in conjunction with the second inductive coil;wherein the first inductive coil is positioned proximate the secondinductive coil, and the fourth inductive coil is positioned proximate tothe fifth inductive coil.
 11. An electronic circuit comprising: first,second, and third inductive coils; and an integrated circuit die,including: a transmit circuit coupled to the first inductive coil; areceive circuit coupled to the second inductive coil; and anelectromagnetic interference (EMI) detection circuit coupled to thethird inductive coil and configured to detect an EMI signal received bythe third inductive coil and at least one of the first inductive coil orthe second inductive coil, and change at least one transmitting of adata signal by the first inductive coil or receiving of the data signalby the second inductive coil based on the detected EMI signal.
 12. Theelectronic circuit of claim 11, wherein the EMI detection circuit isconfigured to change an output power of the transmit circuit based onthe detected EMI signal.
 13. The electronic circuit of claim 11, whereinthe EMI detection circuit is configured to change a threshold of thereceive circuit that determines a logic level of a received data signalreceived by the receive circuit.
 14. The electronic circuit of claim 11,including: a summer circuit in electrical communication with the secondinductive coil and the third inductive coil; wherein the summer circuitcompensates a receive signal received by the second inductive coil usingthe EMI signal received by the third inductive coil.
 15. The electroniccircuit of claim 14, wherein the summer circuit subtracts the EMI signalfrom the receive signal.
 16. A system to automatically improve asignal-to-noise ratio of a data signal communicated by near fieldcommunication, the system comprising: a first circuit for transmittingthe data signal; a second circuit for receiving the transmitted datasignal; a first electromagnetic interference (EMI) detection circuit; afirst near field antenna coupled to the first circuit for transmittingthe data signal; a second near field antenna coupled to the secondcircuit for receiving the data signal, wherein the second near fieldantenna is arranged proximate the first near field antenna; and a thirdnear field antenna coupled to the first EMI detection circuit fordetecting an EMI signal that is substantially received by at least oneof the first near field antenna or the second near field antenna;wherein the first EMI detection circuit is configured to change at leastone of transmitting of the data signal by the first circuit or receivingof the data signal by the second circuit based on the EMI signaldetected by the third near field antenna.
 17. The system of claim 16,wherein the first near field antenna comprises a flat first spiral coilof an electrical conductive material, and the second near field antennacomprises a flat second spiral coil of the electrical conductivematerial, and wherein the first spiral coil and the second spiral coiloverlap and are separated by a dielectric layer.
 18. The system of claim16, a fourth near field antenna; and a second EMI detection circuitcoupled to the fourth near field antenna; wherein the first EMIdetection circuit is configured to control the second circuit to improvea signal-to-noise ratio of the data signal based on the EMI signaldetected by the third near field antenna, and the second EMI detectioncircuit is configured to control the first circuit to improve asignal-to-noise ratio of the data signal based on the EMI signaldetected by the fourth near field antenna.
 19. The system of claim 18,wherein the first circuit and the second EMI detection circuit areincluded in a first integrated circuit die of an integrated circuitpackage; and wherein the second circuit and the first EMI detectioncircuit are included in a second integrated circuit die of theintegrated circuit package.
 20. The system of claim 18, wherein thefirst circuit and the second EMI detection circuit are included in afirst integrated circuit die of a printed circuit board; and wherein thesecond circuit and the first EMI detection circuit are included in asecond integrated circuit die of a printed circuit board.